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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOT MATRIX DIGIT LED DISPLAY (2.3Inch)
Pb
Lead-Free Parts
LMD8821/2HEGR-XX-PF
DATA SHEET
DOC. NO REV. DATE
: QW0905- LMD8821/2HEGR-XX-PF :A : 15 - May - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 1/10
Package Dimensions
60.2(2.37") 7.6X7=53.2(2.1") 9.2 (0.36")
7.6X7 =53.2 (2.1")
60.2 (2.37")
45.8 (1.803")
LMD8821/2HEGR-XX-PF LIGITEK
5.0(0.197")
0.51 TYP
2.54X11=27.97 (1.1")
5.50.5
Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 2/10
Internal Circuit Diagram
LMD8821HEGR-XX-PF
COLUMN ROW PIN
1 2 3 4 5 6 23 24 20 21 17 18 14 15 2 1 5 4
7
8
8
7 11 10
1 22 2 19 3 16 4 13 5 6 7 3 6 9
8 12
LMD8822HEGR-XX-PF
COLUMN ROW PIN
3 5 2 4 1 23 24 20 21 17 18 14 15 2 1
6 5 4
7
8
8 7 11 10
1 22 2 19 3 16 4 13 5 6 7 3 6 9
8 12
RED
GREEN
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 3/10
Electrical Connection
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12
LMD8821HEGR-XX-PF Cathode Column 5 (Green) Cathode Column 5 (Red) Anode Row 5 Cathode Column 6 (Green) Cathode Column 6 (Red ) Anode Row 6 Cathode Column 7 (Green) Cathode Column 7 (Red) Anode Row 7 Cathode Column 8 (Green) Cathode Column 8 (Red) Anode Row 8
PIN NO. 13 14 15 16 17 18 19 20 21 22 23 24
LMD8821HEGR-XX-PF Anode Row 4
Cathode Column 4 (Red) Cathode Column 4 (Green) Anode Row 3
Cathode Column 3 (Red) Cathode Column 3 (Green) Anode Row 2
Cathode Column 2 (Red) Cathode Column 2 (Green) Anode Row 1 Cathode Column 1 (Red) Cathode Column 1 (Green)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 4/10
Electrical Connection
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12
LMD8822HEGR-XX-PF Anode Column 5 (Green) Anode Column 5 (Red) Cathode Row 5 Anode Column 6 (Green) Anode Column 6 (Red ) Cathode Row 6 Anode Column 7 (Green) Anode Column 7 (Red) Cathode Row 7 Anode Column 8 (Green) Anode Column 8 (Red) Cathode Row 8
PIN NO. 13 14 15 16 17 18 19 20 21 22 23 24
LMD8822HEGR-XX-PF Cathode Row 4 Anode Column 4 (Red) Anode Column 4 (Green) Cathode Row 3 Anode Column 3 (Red) Anode Column 3 (Green) Cathode Row 2 Anode Column 2 (Red) Anode Column 2 (Green) Cathode Row 1 Anode Column 1 (Red) Anode Column 1 (Green)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 5/10
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol E Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Operating Temperature Storage Temperature IF IFP 30 G 30 mA UNIT
120
120
mA
PD Ir Topr Tstg
100 10 -25 ~ +85 -25 ~ +85
100
mW
A
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260
Part Selection And Application Information(Ratings at 25)
Electrical
PART NO
common cathode Material Emitted or anode
CHIP
GaAsP/GaP Orange
P (nm)
640 565 640 565
(nm)
45 30 45 30 1.7 1.7 1.7 1.7
Vf(v)
Iv(mcd)
IV-M
Min. Typ. Max. Min. Typ. 2.1 2.1 2.1 2.1 2.6 2.6 2.6 2.6 5.0 7.2 5.0 7.2 8.5 12.8 2:1 8.5 12.8
LMD8821HEGR-XX-PF
GaP
Green
Common Cathode Common Anode
GaAsP/GaP Orange
LMD8822HEGR-XX-PF
GaP
Green
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 6/10
Test Condition For Each Parameter
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
Symbol Vf Iv
Unit volt mcd nm nm
Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V
p
Ir IV-M
A
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 7/10
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25
1.2
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 550 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 8/10
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25
1.2
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 9/10
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260C
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat
60 Seconds Max
25 0 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD8821/2HEGR-XX-PF Page 10/10
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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